Engineering topics

Brown, A. D.

Publications and source records attributed to Brown, A. D..

7 records

NASA NTRS2017

Electrostatic Microshutter Arrays

Based on the Microshutter Array (MSA) subsystems developed at NASA Goddard Space Flight Center (GSFC) for the James Webb Space Telescope (JWST), Next Generation Microshutter Array (NGMSA) has been developed to be used as multi-object selectors for future telescopes in space applications. Microshutter arrays function as transmission devices. Selected shutters fully open at 90 degrees permitting income light going through, while the rest of shutters keep closed. The programmable microshutter open and close make the device perform as a multi object selector that can be used on space telescopes. Utilizing a multi object selector, the telescope efficiency can be increased to 100 times or more. Like JWST MSAs, NGMSA features torsion hinges, light shields, front and back electrodes for shutter actuation, latch, and closing. The difference is that JWST MSA utilized the magnetic actuation while NGMSA the electrostatic actuation.

Micro-electro-mechanical-system (MEMS)↗

NASA NTRS2016

Design, Fabrication, and Testing of a TiN Ti TiN Trilayer KID Array for 3mm CMB Observations

Kinetic inductance detectors (KIDs) are a promising technology for astronomical observations over a wide range of wavelengths in the mm and sub-mm regime. Simple fabrication, in as little as one lithographic layer, and passive frequency-domain multiplexing, with readout of up to 1000 pixels on a single line with a single cold amplifier, make KIDs an attractive solution for high-pixel-count detector arrays. We are developing an array that optimizes KIDs for optical frequencies near 100GHz to expand their usefulness in mm-wave applications, with a particular focus on CMBB-mode measurement efforts in association with the QUBIC telescope. We have designed, fabricated, and tested a 20-pixel prototype array using a simple quasi lumped microstrip design and pulsed DC reactive magnetron-sputtered TiNTiTiN trilayer resonators, optimized for detecting 100GHz (3mm) signals. Here we present a discussion of design considerations for the array, as well as preliminary detector characterization measurements and results from a study of TiN trilayer properties.

passive frequency-domain multiplexing↗

NASA NTRS2014

Properties of Superconducting Mo, Mo2n and Trilayer Mo2n-Mo-Mo2n Thin Films

We present measurements of the properties of thin film superconducting Mo, Mo2N and Mo2N/Mo/Mo2N trilayers of interest for microwave kinetic inductance detector (MKID) applications. Using microwave resonator devices, we investigate the transition temperature, energy gaps, kinetic inductance, and internal quality factors of these materials. We present an Usadel-based interpretation of the trilayer transition temperature as a function of trilayer thicknesses, and a 2-gap interpretation to understand the change in kinetic inductance and internal resonance quality factor (Q) as a function of temperature.

Superconducting↗

NASA NTRS2012

Can the Lateral Proximity Effect Be Used to Create the Superconducting Transition of a Micron-Sized TES?

Recent measurements of micron-sized Mo/Au bilayer Transition Edge Sensors (TESs) have demonstrated that the TES can behave like an S-S'-S weak link due to the lateral proximity effect from superconducting leads. In this regime the Tc is a function of bias current, and the effective Tc shifts from the bilayer Tc towards the lead Tc. We explore the idea that a micron-sized S-N-S weak link could provide a new method to engineer the TES Tc. This method would be particularly useful when small size requirements for a bilayer TES (such as for a hot-electron microbolometer) lead to undesirable shifts in the bilayer Te. We present measurements of a variety of micron-sized normal Au 'TES' devices with Nb leads. We find no evidence of a superconducting transition in the Au film of these devices, in dramatic contrast to the strong lateral proximity effect seen in micron-sized Mo/Au bilayer devices. The absence of a transition in these devices is also in disagreement with theoretical predictions for S-N-S weak links. We hypothesize that a finite contact resistance between the Nb and Au may be weakening the effect. We conclude that the use of the lateral proximity effect to create a superconducting transition will be difficult given current fabrication procedures.

Barrentine, E. M.↗

NASA NTRS2008

Array-scale performance of TES X-ray Calorimeters Suitable for Constellation-X

Having developed a transition-edge-sensor (TES) calorimeter design that enables high spectral resolution in high fill-factor arrays, we now present array-scale results from 32-pixel arrays of identical closely packed TES pixels. Each pixel in such an array contains a Mo/Au bilayer with a transition temperature of 0.1 K and an electroplated Au or Au/Bi xray absorber. The pixels in an array have highly uniform physical characteristics and performance. The arrays are easy to operate due to the range of bias voltages and heatsink temperatures over which solution better than 3 eV at 6 keV can be obtained. Resolution better than 3 eV has also been obtained with 2x8 time-division SQUID multiplexing. We will present the detector characteristics and show spectra acquired through the read-out chain from the multiplexer electronics through the demultiplexer software to real-time signal processing. We are working towards demonstrating this performance over the range of count rates expected in the observing program of the Constellation-X observatory. We mill discuss the impact of increased counting rate on spectral resolution, including the effects of crosstalk and optimal-filtering dead time.

Kilbourne, C. A.↗

NASA NTRS2008

Development and Operation of Arrays of TES x-ray Microcalorimeters Suitable for Constellation-X

Having already developed a transition-edge-sensor (TES) microcalorimeter design that enables uniform and reproducible high spectral resolution (routinely better than 3 eV resolution at 6 keV) and is compatible with high fill-factor arrays, we are now working towards demonstrating this performance at high count rates and with the multiplexed read-out needed for instrumenting the Constellation-X X-ray Microcalorimeter Spectrometer (XMS) focal plane array. Design changes that increase the speed of the individual XMS pixels, such as lowering the heat capacity or increasing the thermal conductance of the link to the 50-mK heatsink, result in larger, faster signals, thus the coupling to the multiplexer and the overall bandwidth of the electronics must accommodate this increase in slew rate. In order to operate the array with high incident x-ray flux without unacceptable degradation of the spectral resolution, the magnitude of thermal and electrical crosstalk must be controlled. We will discuss recent progress in the thermal and electrical designs of our close-packed TES arrays, and we will present spectra acquired through the read-out chain from the multiplexer electronics, through the demultiplexer software, to real-time signal processing.

Kilbourne, C. A.↗

NASA NTRS2007

Materials Development for Auxiliary Components for Large Compact Mo/Au TES Arrays

We describe our current fabrication process for arrays of superconducting transition edge sensor microcalorimeters, which incorporates superconducting Mo/Au bilayers and micromachined silicon structures. We focus on materials and integration methods for array heatsinking with our bilayer and micromachining processes. The thin superconducting molybdenum bottom layer strongly influences the superconducting behavior and overall film characteristics of our molybdenum/gold transition-edge sensors (TES). Concurrent with our successful TES microcalorimeter array development, we have started to investigate the thin film properties of molybdenum monolayers within a given phase space of several important process parameters. The monolayers are sputtered or electron-beam deposited exclusively on LPCVD silicon nitride coated silicon wafers. In our current bilayer process, molybdenum is electron-beam deposited at high wafer temperatures in excess of 500 degrees C. Identifying process parameters that yield high quality bilayers at a significantly lower temperature will increase options for incorporating process-sensitive auxiliary array components (AAC) such as array heat sinking and electrical interconnects into our overall device process. We are currently developing two competing technical approaches for heat sinking large compact TES microcalorimeter arrays. Our efforts to improve array heat sinking and mitigate thermal cross-talk between pixels include copper backside deposition on completed device chips and copper-filled micro-trenches surface-machined into wafers. In addition, we fabricated prototypes of copper through-wafer microvias as a potential way to read out the arrays. We present an overview on the results of our molybdenum monolayer study and its implications concerning our device fabrication. We discuss the design, fabrication process, and recent test results of our AAC development.

Finkbeiner, F. m.↗