Engineering topics
Bae, Sam Y.
Publications and source records attributed to Bae, Sam Y..
Single Lens Dual-Aperture 3D Imaging System: Color Modeling
In an effort to miniaturize a 3D imaging system, we created two viewpoints in a single objective lens camera. This was accomplished by placing a pair of Complementary Multi-band Bandpass Filters (CMBFs) in the aperture area. Two key characteristics about the CMBFs are that the passbands are staggered so only one viewpoint is opened at a time when a light band matched to that passband is illuminated, and the passbands are positioned throughout the visible spectrum, so each viewpoint can render color by taking RGB spectral images. Each viewpoint takes a different spectral image from the other viewpoint hence yielding a different color image relative to the other. This color mismatch in the two viewpoints could lead to color rivalry, where the human vision system fails to resolve two different colors. The difference will be closer if the number of passbands in a CMBF increases. (However, the number of passbands is constrained by cost and fabrication technique.) In this paper, simulation predicting the color mismatch is reported.
3D Imaging with a Single-Aperture 3-mm Objective Lens: Concept, Fabrication and Test
There are many advantages to minimally invasive surgery (MIS). An endoscope is the optical system of choice by the surgeon for MIS. The smaller the incision or opening made to perform the surgery, the smaller the optical system needed. For minimally invasive neurological and skull base surgeries the openings are typically 10-mm in diameter (dime sized) or less. The largest outside diameter (OD) endoscope used is 4mm. A significant drawback to endoscopic MIS is that it only provides a monocular view of the surgical site thereby lacking depth information for the surgeon. A stereo view would provide the surgeon instantaneous depth information of the surroundings within the field of view, a significant advantage especially during brain surgery. Providing 3D imaging in an endoscopic objective lens system presents significant challenges because of the tight packaging constraints. This paper presents a promising new technique for endoscopic 3D imaging that uses a single lens system with complementary multi-bandpass filters (CMBFs), and describes the proof-of-concept demonstrations performed to date validating the technique. These demonstrations of the technique have utilized many commercial off-the-shelf (COTS) components including the ones used in the endoscope objective.
Pneumatic Haptic Interfaces
An instrumentation system for direct measurement of the thermal conductivity of a small sample of a highly insulating material has been devised. As used here, (1) "small" signifies having dimensions of the order of two centimeters - significantly less than the sizes of specimens for which prior devices for direct measurement of thermal conductivity have been designed; and (2) "highly insulating" signifies having thermal conductivity of the order of that of air. The heart of the system is an assembly that includes two copper disks - one electrically heated, the other cooled with chilled water. The disks are separated by a guard ring made of strong, thermally insulating polymethacrylamide foam. The sample fits between the copper disks and within the ring (see figure). Matched thermocouples are used to measure the temperatures of the heated and cooled disks. The heated and cooled disks are affixed to larger foam disks, and the essentially still air in the gap between the larger disks insulates the sides of the specimen. This air gap region can be further divided by extending the foam ring into the gap region. The entire assembly as described thus far is lightly clamped together by means of nylon threaded rods and is placed inside a cylindrical chamber wherein the temperature is maintained at a set value (typically, 25 C).
Millimeter-Wave Wireless Power Transfer Technology for Space Applications
In this paper we present a new compact, scalable, and low cost technology for efficient receiving of power using RF waves at 94 GHz. This technology employs a highly innovative array of slot antennas that is integrated on substrate composed of gold (Au), silicon (Si), and silicon dioxide (SiO2) layers. The length of the slots and spacing between them are optimized for a highly efficient beam through a 3-D electromagnetic simulation process. Antenna simulation results shows a good beam profile with very low side lobe levels and better than 93% antenna efficiency.
Silicon Nanotips Antireflection Surface for Micro Sun Sensor
We have developed a new technique to fabricate antireflection surface using silicon nano-tips for use on a micro sun sensor for Mars rovers. We have achieved randomly distributed nano-tips of radius spanning from 20 nm to 100 nm and aspect ratio of ~200 using a two-step dry etching process. The 30(deg) specular reflectance at the target wavelength of 1 (mu)m is only about 0.09 %, nearly three orders of magnitude lower than that of bare silicon, and the hemispherical reflectance is ~ 8%. By changing the density and aspect ratio of these nanotips, the change in reflectance is demonstrated. Using surfaces covered with these nano-tips, the critical problem of ghost images that are caused by multiple internal reflections in a micro sun sensor was solved.
Modifications of Fabrication of Vibratory Microgyroscopes
A micromachining process for the fabrication of vibratory microgyroscopes from silicon wafers, and aspects of the microgyroscope design that are inextricably linked with the fabrication process, have been modified in an effort to increase production yields from perspectives of both quantity and quality. Prior to the modifications, the effective production yield of working microgyroscopes was limited to one or less per wafer. The modifications are part of a continuing effort to improve the design and increase production yields to more than 30 working microgyroscopes per wafer. A discussion of pertinent aspects of the unmodified design and the unmodified fabrication process is prerequisite to a meaningful description of the modifications. The design of the microgyroscope package was not conducive to high yield and rapid testing of many microgyroscopes. One of the major impediments to high yield and testing was found to lie in vibration- isolation beams around the four edges of each microgyroscope, which beams were found to be unnecessary for achieving high resonance quality factors (Q values) characterizing the vibrations of petallike cantilevers. The fabrication process included an 8- m-deep plasma etch. The purpose of the etch was to create 8- m vertical gaps, below which were to be placed large gold evaporated electrodes and sensing pads to drive and sense resonant vibrations of the "petals." The process also included a step in which bridges between dies were cut to separate the dies. The etched areas must be kept clean and smooth (free of debris and spikes), because any object close to 8 m high in those areas would stop the vibrations. However, it was found that after the etch, there remained some spikes with heights that were, variously, almost as high or as high as the etch depth. It also was found that the cutting of bridges created silicon debris, some of which lodged in the 8- m gaps and some of which landed on top of the petals. The masses added to the petals by the debris altered resonance frequencies and/or Q values to unacceptable degrees. Hence, the spikes and the debris have been conjectured to cause most of the observed malfunctions of newly fabricated microgyroscopes. Another pertinent aspect of the unmodified design and process was the fabrication of electrodes and the 8- m capacitance gap on a 500- m-thick wafer, and the fabrication of a 3-mm-thick baseplate from another wafer. It was necessary to bond these wafers to each other in an assembly step that was later found to be superfluous in that it could be eliminated by a suitable modification of the design.