Wide bandwidth TM tunable vernier rings for heterogeneously integrated lasers
Explore the source record for details and available documents.
Henry, Nathan↗
Engineering topics
Arterburn, Shawn Carson
Publications and source records attributed to Arterburn, Shawn Carson.
Gasb-to-Si Direct Wafer Bonding and Thermal Budget Considerations for Photonic Applications
Explore the source record for details and available documents.
Martinez, William Michael↗
Experimental Device for Probing Quantum Acoustoelectric Interaction
Explore the source record for details and available documents.
Hackett, Lisa Anne Plucinski↗
Thin-Film Lithium Niobate Electro-Optic Modulators with Integrated Silicon Photonic Thermo-Optic Phase Shifters
Explore the source record for details and available documents.
Boynton, Nicholas↗
Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers
Explore the source record for details and available documents.
Wood, Michael Grey↗
Buried-Electrode Hybrid Bonded Thin-Film Lithium Niobate Electro-Optic Mach-Zehnder Modulators
Hybrid bonded silicon nitride thin-film lithium niobate (TFLN) Mach-Zehnder modulators (MZMs) at 1310 nm were designed with metal coplanar waveguide electrodes buried in the silicon-on-insulator (SOI) chip. Here, the MZM devices showed greatly improved performance compared to earlier devices of a similar design, and similar performance to comparable MZM devices with gold electrodes made on top of the TFLN layer. Both devices achieve a 3-dB electro-optic bandwidth greater than 110 GHz and voltage-driven optical extinction ratios greater than 28 dB. Half-wave voltage-length products (VπL) of 2.8 and 2.5 V∙ cm were measured for the 0.5 and 0.4 cm long buried metal and top gold electrode MZMs, respectively.
42 ENGINEERING↗