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Aguirre, Fernando

Publications and source records attributed to Aguirre, Fernando.

7 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

High-Rate Ka-Band Modulator for the NISAR Mission

In order to meet ever-increasing data return requirements, more satellites are using the near-Earth Ka-band (25.5 – 27.0 GHz) to achieve higher downlink rates. The paper discusses the Universal Space Transponder - Ka-band Modulator (UST-KaM) developed at the NASA Jet Propulsion Laboratory for the NASA-ISRO SAR (NISAR) mission, which is capable of transmitting up to 1.74 Gbps with 7/8 LDPC encoding. The UST-KaM utilizes OQPSK with both baseband and RF filtering to contain the 1 Gsps transmission spectrum within the 1.5 GHz Ka-band, even with the use of an external, saturated amplifier. Due to the high data rates involved, several technical hurdles were overcome in both the digital and RF designs. The UST-KaM is a software defined radio with two digital circuit board assemblies: a low speed housekeeper board for commanding and telemetry, and a high-rate signal processing board known as the Signal Processing Module (SPM). The SPM receives data from the spacecraft via a SERDES interface at up to 2 Gbps, processes and encodes the data using a Xilinx Virtex-5 FPGA, and produces 1 Gsps OQPSK I and Q waveforms via synchronized, multiplexed DACs. The RF Electronics in the UST-KaM employ a heterodyne architecture in which the I/Q digital waveforms are filtered and then up-converted using a sub-harmonic IQ mixer. The LO of the converter, which is included in the exciter assembly, is at 13.125GHz, and the RF output is a 26.25GHz carrier which is modulated with the OQPSK waveforms. The output of the mixer is then filtered using low loss quartz thinfilm edge coupled Chebyshev filters and amplified through a series of low gain Ka-Band amplifiers. The exciter assembly also has a 2GHz, low-phase-noise, PLL synthesizer to supply the clock to the DACs for the high rate digital waveforms.

Spurgers, Carl↗
NASA NTRS2017

The Universal Space Transponder: A Next Generation Software Defined Radio

The Universal Space Transponder (UST) is a next generation transponder developed at the Jet Propulsion Laboratory to meet a large variety of telecom, navigation, and radio science needs for future deep-space and near-Earth missions. This paper details the UST software defined radio design and describes how the combination of a modular hardware architecture and in-flight reprogrammability enables a new level of flexibility and expandability for a space transponder. The UST uses common power and digital processing assemblies that can be integrated with a variety of RF modules and is capable of simultaneous, multiband operations with data rates up to 37.5 Mbps RX and 300 Mbps TX. This allows a single radio to support all the direct-to-Earth and relay communication requirements for even complex mission scenarios, reducing the total cost, mass, and power. The discussion includes a description of the current UST engineering models that have been built and tested, as well as details about the next generation capabilities supported by UST, including advanced link coding and modulation, radiometric techniques, and in-radio protocol handling. Details are also presented on RF modules and digital processing in development for radio science and astronomy purposes, including a bistatic radar receiver and broadband planetary emissions receiver. These will demonstrate the ability to integrate low-cost science instruments into the UST architecture, further expanding the versatility of the UST.

Jedrey, Thomas↗
NASA NTRS2016

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗